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Barrday is pleased to announce the introduction of our new line of toughened, low heat release epoxy prepreg systems designed for a variety of aircraft interior applications.  These environmentally friendly materials provide the low OSU heat release typically attributed to phenolic systems and are available in both press (EPM503-1) and bag molding (EPM505) grades. For additional information please visit us at www.barrday.com.  

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