Composite Technical Data Sheets

(Contact Us for further information on the materials listed below or any other Barrday products)

 

Engineered Thermoplastics 

 

Product

Description

TU100  PPS Tape

TF100  PPS Semi-Preg

 

High temperature semi-crystalline polymer with low moisture absorption and
excellent chemical/solvent resistance. Very good FST properties.

Tg of 200° F (95° C)

 

TU200 PEEK Tape

TF200 PEEK Semi-Preg

 

Very high temperature semi-crystalline polymer with good combination of toughness, chemical solvent resistance, low moisture absorption, and FST properties.

Tg of 289° F (143° C)

 

TU202 LMPAEK Tape

 

 

Same benefits as PEEK with a wider and lower temperature processing window.  

Tg of 303° F (151° C)

TU300 PEKK Tape

TF300 PEKK Semi-Preg

 

Very high temperature semi-crystalline polymer with good combination of toughness, chemical solvent resistance, low moisture absorption, and FST properties.

Tg of 319° F (159° C)

 

TU400 PEI Tape

 

High temperature tough amorphous polymer with excellent FST properties.

TU1100 PVDF Tape

Semi-crystalline polymer with good combination of strength, toughness, chemical and solvent resistance.

 

 

Epoxy Prepreg Systems

 

Product

Description

EPM502

Toughened epoxy prepreg system suitable for autoclave, press or bag molding operations. Fire retardant per FAR 25.833. Tg of 300° F (150° C)

 

EPM503-1

 

Toughened, low heat release epoxy prepreg system (Sub 30/30 OSU). Self-adhesive to honeycomb. Excellent surface finish. EPM503-1 is offered as a press grade system. REACH compliant.

 

EPM505

 

Toughened, low heat release epoxy prepreg system (Sub 40/40 OSU). Self-adhesive to honeycomb. Excellent surface finish. EPM505 is designed for bag molding. REACH compliant.

 

EPH350

 

High temperature curing, fire retardant epoxy per FAR 25.833. Excellent combination of toughness and high Tg of 300°F (150° C)

 

 

Phenolic Prepreg Systems

 

Product

Description

LC194

 

Highly self-adhesive to aramid honeycomb. Meets flammability requirements for use in aircraft interiors.

 

LC196

 

Snap cure prepreg. Self-adhesive to honeycomb. Meets flammability requirements
for use in aircraft interiors. Excellent surface finish.

 

LC294

 

Suitable for press and bag molding. Self-adhesive to aramid honeycomb with extremely low heat release rates. (Sub 30/30 OSU)

 

LC296

 

Snap cure prepreg. Very good adhesion and extremely low heat release rates.
(Sub 30/30 OSU)

 

PH4101

 

 

Designed for use in high temperature aerospace applications including ducting, engine components and heat shields. Tg of 310° F (155° C)

PSR133

 

Exceptional char yield for carbon carbon applications and does not exhibit macro
cracking in high modulus composite structures. Conforms to MIL-R-9299C, Grade B.

 

LR1406H*  

X085*

 

Low fired stretch broken and spun carbon. Improved erosion resistance for solid
rocket motors. Rayon replacement

 

 

* Contact Us for technical data sheets of our ablative prepreg materials